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The Dionics series of MOS chip capacitors are economical
devices, specifically designed for hybrid circuit applications
where high capacitance values along with reliability, small
physical size, and stability are required. They are extremely
useful where compatible assembly techniques are of prime consideration.
Each device is gold backed and may be conductive epoxy or
eutectically bonded with the chip bottom serving as one terminal.
An aluminum bond pad on top of the chip is then contacted,
using conventional wire bonding techniques, to serve as the
second terminal.
Features:
- Thinnest chips available
- Increased high temperature stability
- Low leakage current
- High reliability
- High capacitance values (0.3 to 330pf)
- Multi-value & trimmer capacitors
- Custom designs available
Applications:
- General hybrid circuit usage
- Telecommunications
- Telephony
- Medical electronics
- Digital circuitry
- High-density packaging
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